Thermisches Design zur Verbesserung der Leistung des Leistungsmoduls

       MOS tubes, diodes, transformers and other spare parts in the power module will generate large heat during operation, and the continuous high temperature will have a great impact on its reliability, such as reducing the service life of its internal electrolytic capacitor, reducing the insulation of transformer enamelled wire, transistor damage, material thermal aging, solder joint falling off and so on. Statistics show that the reliability of electronic components decreases by 10 percent every 2 degree rise in temperature. Thermal design is essential to avoid overheating of power modules.

    For the thermal design of power module, the thermal design engineer can start with reducing loss and thermal management.

Reduzieren Sie den Energieverlust:

Zu den Schlüsselkomponenten, die Verluste im Leistungsmodul verursachen, gehören hauptsächlich MOS-Röhre, Diode, Transformator, Leistungsinduktivität, Strombegrenzungswiderstand usw. Verluste sind die direkte Ursache für die Wärmeerzeugung, und die Reduzierung von Verlusten ist die Grundlage für die Reduzierung der Wärmeerzeugung. Wie kann man den Verlust reduzieren? Ingenieure können im Prozess des Schaltungsdesigns fortschrittliche Schaltungstopologie und Umwandlungstechnologie anwenden, um das Ziel von hoher Leistung und geringem Verlust zu erreichen.

Wärmemanagement:

       Thermal management is very important in the design of power module. Because the heating device and the power supply shell are not 100 percent bonded, there is a small amount of air gap, and the thermal conductivity of the air is very small, only 0.02w/m · K, so the heat on the heating device can not be quickly transferred to the power supply shell, resulting in slow heat dissipation efficiency of the power module. 

      We can add high thermal conductivity interface materials to fill the gap, eliminate the air between the heater and the power supply, increase the heat transfer area, reduce the thermal resistance and improve the heat transfer efficiency. In addition, the thermal conductivity of thermal conductive silicon film is as high as 1.0 w / m · K, or even higher, more than 50 times that of air, which greatly improves the heat dissipation of power module.

         At the same time, the installation of heatsink and cooling fan is also one of the very effective solutions. For some super high-power equipment, liquid cooling solution can even be considered. Although the cost increases, it's cooling effect is better, which is helpful to improving the service life of power module.